Thermal Interface Materials for the New Generation of Electronics
Electronic devices are becoming smaller and more powerful, leading to a greater need for heat dissipation. Fortunately, there is an innovative solution: Parker Chomerics THERM-A-GAP GEL 50TBL, an advanced thermal interface material (TIM). This material has a high thermal conductivity of 5.0 W/m-K. Even an extremely thin layer of just 0.05 mm can enhance heat…