CHO-BOND 584-208 is a two-component, silver-filled, electrically conductive epoxy adhesive, which can be used to replace soldered or welded joints under certain conditions.
It has been developed for use in high volume applications where a strong, long lasting and low ohmic electrically conductive adhesive bond is required.
The typical resistance is 0.002 ohm-cm and the shear strength is 1000 psi, making it excellent for permanently bonded surfaces.
Typical applications are:
- fixing and grounding electrical components,
- to replace cold soldering
- electrically conductive sealing and joining of composite parts and housings
Complete curing of CHO-BOND 584-208 is achieved in just 45 minutes. With a 1:1 ratio, the two components are easy to mix.
Parker Chomerics offers this CHO-BOND in containers of approx. 120ml and 475ml.
