Parker Chomerics introduces the PAD60, a new thermal interface material that is very competitive in both price and performance.

With a specified thermal conductivity of 6W/m-K, this fairly soft gap filler is an extremely effective solution between a heat sink and an electronic component.

The competitive price, positions the PAD60 in consumer electronics, LED applications, automotive electronics, handheld equipment, etc.

The advantages of this new product are better heat conductivity, easier processing and lower price, resulting in a very competitive product. With 31 Shore 00, it is 40% softer than current pads with this range of cooling capacity and it forms easily on irregular surfaces. It is one of the softest 6W/m-K pads on the market.

The material is available in both custom and standard dimensions from 0.5 to 5 mm thickness. It is V-0 flame retardant and 5,000 Vac/mm electrically insulating. There is also a budget version PAD30 available with a thermal conductivity of 3W/m-K.