Parker Chomerics has developed the advanced thermal gap filler, THERM-A-GAP PAD 80LO, specifically for durable, mission-critical, and high-power electronic applications in sectors such as high-performance computing, defense, telecommunications, and automotive.

With a high thermal conductivity of 8.0 W/m·K and exceptionally low silicone oil loss, PAD 80LO provides a sustainable, reliable solution for environments where traditional silicone-based materials may cause issues over the long term.

The unique material properties, including excellent pressure resistance and low compression force, ensure optimal heat transfer, protecting vulnerable electronic components with an extremely long lifespan. This results in more efficient thermal management and increased system reliability.

PAD 80LO is available in sheets or custom-cut sizes, offering a versatile and high-quality solution for demanding applications.