Electronic devices are becoming smaller and more powerful, leading to a greater need for heat dissipation. Fortunately, there is an innovative solution: Parker Chomerics THERM-A-GAP GEL 50TBL, an advanced thermal interface material (TIM). This material has a high thermal conductivity of 5.0 W/m-K. Even an extremely thin layer of just 0.05 mm can enhance heat transfer and optimize the performance of electronic devices.

THERM-A-GAP GEL 50TBL is composed of a silicone matrix with a high density of thermally conductive particles. This material is not only thermally conductive but also consistent and deformable. As a result, it can easily be applied to complex surfaces and adapt to irregularities.

It maintains its thermal and mechanical properties at temperatures ranging from -55 to 200°C, making it suitable for applications exposed to extreme temperatures and thermal cycles. THERM-A-GAP GEL 50TBL can be used in various industries such as telecommunications, automotive, and aerospace, thanks to its advanced features and benefits.

The material is available in different packaging units, ranging from 10cc syringes to 3.79-liter industrial buckets.